Sunday, January 5, 2014
Why SMT Reflow Soldering Oven Cannot Be Avoided By Electronic Assembling Firms
By Harriett Crosby
When it comes to soldering of electrical components on to printed circuit board (PCB), surface mount technology (SMT) is the most widely used method. The SMT reflow soldering oven is the machine that has greatly contributed to this technology. Highly technical principles in bonding are all put together to ensure optimal functionality of this particular machine that has literally transformed the electronics industry. In addition to precise control of this process, the machine consumes less power than other methods used and produces more products per unit time than any other method.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The oven gets heated by ceramic heaters and heat transfer to the assembly points can be through radiation (hot air) or the infrared electromagnetic radiation depending on the machine make. Other technologies of heat transfer are also used.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
The reflow soldering is the process of joining electronic devices to the printed circuit boards as the contact pads. This requires the use of solder paste and heat to attach the components. It is the SMT reflow soldering oven that is best in this. It allows for better control of heating process that minimizes chances of defective components.
It involves joining of electrical components on to contact pads with solder paste and heat. In the process of highly controlled heating that take place in the oven, solder melts in the right position and permanently join the electrical components on PCB in the process.
The PCB and loosely attached components is then drawn into the heating chambers through a conveyor belt. This then undergoes into four distinct phases in this machine. The first phase is known as preheat zone. This is where the melting point of the solvent is set. The ramp rate (time/temperature rate) is also determined and used to control heating in the following stages.
At thermal soak zone, the components are exposed to heat for about 60-120 seconds. The heat produced at this stage should be enough to remove all the volatiles of solder paste. The reflow zone then takes over. At this stage, the components get exposed to the maximum possible temperature which is normally set a few degrees below the maximum temperature tolerable by the component with the lowest tolerable temperature. This reduces surface tension at joints, the result of which is the bonding between pads and the electronic components.
In the fourth and final zone, the process of cooling takes place. This too is a controlled process. The heating and cooling is such controlled that the PCB and components are not exposed to thermal shock. This is perhaps what makes SMT reflow soldering oven outperform all other methods of bonding.
The oven gets heated by ceramic heaters and heat transfer to the assembly points can be through radiation (hot air) or the infrared electromagnetic radiation depending on the machine make. Other technologies of heat transfer are also used.
They are simpler to operate and work much faster with high accuracy level. They also have higher production level with ability to produce more that 136,000 components in a single hour. Attachment of the components can also be done on both sides at the same time with better electrical efficiency.
Electronic assembly just like any other industry is highly competitive. In order to remain a relevant market player, a firm must acquire the latest technology and most efficient production methods. The use of SMT reflow soldering oven is no longer optional in electrical assembly. In addition to higher level of production, efficiency and lower power consumption, the machine guarantees firms future survival and profitability.
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